A solder ball jet nozzle bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball jet nozzle therein.
A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder ball jet nozzle for which the retention structures are positioned to retain.
The solder ball jet nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.