Solder jetting is a growing technology for microelectronic packaging in diverse range of applications. In this paper, an electromagnetic jetting device is developed to direct deposit solder droplets. Experimental results show that the electromagnetic jetting is feasible to deposit solder, and uniform solder ball jet nozzle can be obtained.
The process of jetting and deposition of solder droplets is analyzed, and the influence of the solder ball jet nozzle diameter on the droplet diameter is obtained.
Our results show promise for electromagnetic jetting as a potential tool in fabrication of metal droplets.