Solder ball jet nozzle connect pad-on-via assembly process
A process for filling a via with a conductive material, the process comprising the steps of: providing a silicon wafer with at least one through-via; mounting the silicon wafer onto a surface of a mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a solder ball jet nozzle in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills the through-via and the cavity in the mounting substrate to form a conductive via.
The process for filling a through-via of claim 1 wherein the silicon wafer has a thickness of at least about 28 mil.
The process for filling a through-via of claim 1 wherein the solder ball jet nozzle comprises a piezoelectric pressure inducer.
The process for filling a through-via of claim 1 further comprising the step of: reflowing the conductive material to fill the via.
A process for filling a through-via with a conductive material, the process comprising the steps of: providing a silicon wafer having a first surface and a second surface generally opposed to each other with at least one through-via, wherein the first surface comprises an electrical interconnect; mounting the silicon wafer onto a surface of a mounting substrate such that the second surface of the silicon wafer is in contact with the surface of the mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a device for depositing balls of molten material in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills both the through-via and the cavity in the mounting substrate and the conductive material wets the interconnect to form a conductive via.