In this application, solder ball jet nozzle dispensing for Chip Scale Packages, solder paste dots 150 microns in diameter are dispensed at high speed on to the CSP pads on the printed circuit board (PCB).
Dispensing provides better control and fewer “Insufficients” than the traditional printing process. More complex products, with a variety of solder paste deposition requirements, are pushing the limitations of printing and opening opportunities for dispensing.