We are focused on solder paste deposition for small component joining including 01005 (metric 0402) resistors and capacitors, Chip Scale Package interconnections and RF Shield soldering. Solder ball jet nozzle systems can dispense a variety of solder ball jet nozzle types. Type 4, 5, 6 and 7 formulations are Jet dispensed successfully. Dot size is dependent on solder ball jet nozzle formulation, Jet hardware component selection and process parameters.
Solder ball jet nozzle properties such as solder ball size, particle size distribution, metals to flux ratio and flux chemistry play a vital role in dot size and jetting consistency.
We work to optimize solder ball jet nozzle formulations for jetting, we use both “Jetting” and “Jet Stamping” dispensing techniques in order to meet dot size requirements and part access issues with populated assemblies.