A solder ball jet nozzle is a glob of solder that connects a chip package and a PCB. You can also use solder boards to connect stacked boxes in multichip panels.
They can be mounted on circuitry boards manually or through automated equipment. Their placement is usually secured through a tacky flux.
Solder ball jet nozzles are also the most common defect that detracts from SMT assembly processes. However, solder ball jet nozzles are a double-edged sword. A solder ball jet nozzle placed within 0.13mm of traces or wider than 0.13mm in diameter violates the principle of minimum electrical clearance.
The errors that can cause a solder ball to bring about defects in an assembled PCB are innumerable. According to IPC, solder ball jet nozzles do not cause defects long as they’re held firmly in place. This article examines the good, the bad, and the ugly of solder ball jet nozzle.