A solder ball jet nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a solder ball jet nozzle body including a tip, the tip disposed at a distal end of the solder ball jet nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the solder ball jet nozzle body and configured to convey the solder ball to or from the tip.
The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.