A solder ball bonding tool includes a solder ball jet nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the solder ball jet nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The solder ball jet nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.
- A solder ball bonding tool solder ball jet nozzle, comprising: an inner bore comprising a plurality of equivalent columnar surfaces equally spaced around the perimeter of said inner bore; anda plurality of retention structures each formed by an intersection of two said adjacent columnar surfaces such that only one pointes structure per retention structure extends into said inner bore in a position to retain a solder ball within said solder ball jet nozzle; wherein said nozzle is composed of a cemented carbide having up to a 4.5% cumulative percentage of cobalt and gold serving as a binder.
- The solder ball jet nozzle wherein a projected shape formed by intersecting said retention structures is substantially circular and has a diameter that is less than the diameter of a solder ball for which said retention structures are positioned to retain.
- The solder ball jet nozzle wherein said columnar surfaces of said inner bore are concave surfaces.
- The solder ball jet nozzle wherein said columnar surfaces of said inner bore are substantially circular concave surfaces having a diameter that is less than the diameter of a solder ball for which said retention structures are positioned to retain.
- The solder ball jet nozzle further comprising a nozzle tip comprising a continuous outer side wall, and wherein said columnar surfaces of said inner bore do not intersect an outermost interface of said outer sidewall of said nozzle tip.
- The solder ball jet nozzle wherein said plurality of columnar surfaces comprises three or more columnar surfaces and wherein said plurality of retention structures comprises three or more retention structures.
- The solder ball jet nozzle wherein said plurality of columnar surfaces comprises at least four columnar surfaces and wherein said plurality of retention structures comprises at least four retention structures.