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In the laser spray tin welding system, the tin balls are transported from the tin ball box to the solder ball jet nozzle. After being heated and melted by the laser, they are sprayed from the special solder ball jet nozzle and directly cover the pad without additional flux or other tools. Solder ball spray welding is adopted, with high welding precision, and there are requirements for temperature or soft board connection welding area. During the whole process, the solder joints are not in contact with the main body of the soldering, which solves the electrostatic threat caused by the contact during the soldering process.

The laser spray tin welding system has the following characteristics:

1. The laser processing precision is high, the spot is small, the processing time is controlled by the program, and the precision is higher than that of the traditional process.

2. Non-contact processing, no contact with static electricity caused by welding, can be processed in parts that are not easy to be welded by conventional methods.

3. The small laser beam replaces the soldering iron head, which is also easy to process when there are other interference objects on the surface of the workpiece

4. Local heating, small heat affected zone; no static threat.

5. Laser is a clean processing method, easy to maintain and easy to operate. Repeated operation stability is good.

6. Six-axis working platform, equipped with synchronous CCD positioning and monitoring system, automatic clamping, automatic judgment of whether there is a workpiece, can ensure welding accuracy and yield.

7. The laser spray tin welding system does not need flux and other tools, which ensures the cleanliness of processing.

8. The heating speed is fast and the positioning is accurate, which can be completed within 0.2 seconds.

9. The diameter of the solder ball can be as small as 50μm, which is suitable for high-precision soldering.

10. The yield of solder is higher than that of ordinary automatic soldering machines.

11. With a visual positioning system, it is suitable for assembly line production.

Studies have been conducted to show the effects of Pd film thickness on the solder ball jet nozzle joint reliability. The subject of the survey was electroless Ni/Pd/Au plating on an Sn-3.0Ag-0.5Cu (SAC305) solder ball jet nozzle joint. The study used a solder ball jet nozzle shear test.

After multiple reflow cycles, the Pd film thickness between 0.05-0.02 microns was the optimum for solder joint reliability. Studies have also shown that solder ball jet nozzle joints are more reliable when using 0.02 micron thick electrodes.

This result is even better than that obtained using electroless Ni/ Au plating.

The study also shows that the shape and thickness of the intermetallic compounds (IMCs) determine a solder ball jet nozzle’s reliability. In particular, the degree of adhesion at the dendrite layer of the IMCs/solder interface immensely influenced a solder ball jet nozzle’s reliability.

It was also shown that (Cu, Ni, Pd)6Sn5 IMCs containing minute Pd yield excellent solder ball jet nozzle joint reliability mainly because Pd inhibited the growth of IMC.

A solder ball jet nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a solder ball jet nozzle body including a tip, the tip disposed at a distal end of the solder ball jet nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the solder ball jet nozzle body and configured to convey the solder ball to or from the tip.

The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.

In the laser spray tin welding system, the tin balls are transported from the tin ball box to the solder ball jet nozzle. After being heated and melted by the laser, they are sprayed from the special solder ball jet nozzle and directly cover the pad without additional flux or other tools.

Solder ball spray welding is adopted, with high welding precision, and there are requirements for temperature or soft board connection welding area. During the whole process, the solder joints are not in contact with the main body of the soldering, which solves the electrostatic threat caused by the contact during the soldering process.

We are focused on solder paste deposition for small component joining including 01005 (metric 0402) resistors and capacitors, Chip Scale Package interconnections and RF Shield soldering. Solder ball jet nozzle systems can dispense a variety of solder ball jet nozzle types. Type 4, 5, 6 and 7 formulations are Jet dispensed successfully. Dot size is dependent on solder ball jet nozzle formulation, Jet hardware component selection and process parameters.

Solder ball jet nozzle properties such as solder ball size, particle size distribution, metals to flux ratio and flux chemistry play a vital role in dot size and jetting consistency.

We work to optimize solder ball jet nozzle formulations for jetting, we use both “Jetting” and “Jet Stamping” dispensing techniques in order to meet dot size requirements and part access issues with populated assemblies.

Wide-Solder Ball Jet Nozzles

Spreads hot air over a wider area for drying, stripping paint, shaping plastic, welding bitumen, etc.

Deflector Solder Ball Jet Nozzles

Protects adjoining surfaces from overheating, such as panes of glass, corners and close quarters.

Reflector Solder Ball Jet Nozzles

Directs hot air around pipes and tubing for even heating. Used for soldering, bending and shrinking.

Silione Seam Roller

1 ¾” wide head with ball bearings.

Flexible Stand with Magnetic Base

Magnetic base keeps stand in place while working. Flexible arm allows user to adjust solder ball jet nozzles to the optimal working position.

In this application, solder ball jet nozzle dispensing for Chip Scale Packages, solder paste dots 150 microns in diameter are dispensed at high speed on to the CSP pads on the printed circuit board (PCB).

Dispensing provides better control and fewer “Insufficients” than the traditional printing process. More complex products, with a variety of solder paste deposition requirements, are pushing the limitations of printing and opening opportunities for dispensing.

Solder ball jet nozzles are as important to jetting as the power unit itself – without the correct solder ball jet nozzle – you loose efficiency and cleaning power and this will cost you time and money.

The correct solder ball jet nozzle will substantially increase the cleaning power enabling a smaller jetter unit to clean like a larger unit.

1. A process for filling a via with a conductive material, the process comprising the steps of: providing a silicon wafer with at least one through-via; mounting the silicon wafer onto a surface of a mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a solder ball jet nozzle in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills the through-via and the cavity in the mounting substrate to form a conductive via.
2. The process for filling a through-via of claim 1 wherein the silicon wafer has a thickness of at least about 28 mil.
3. The process for filling a through-via of claim 1 wherein the solder ball jet nozzle comprises a piezoelectric pressure inducer.
4. The process for filling a through-via of claim 1 further comprising the step of: reflowing the conductive material to fill the via.
5. A process for filling a through-via with a conductive material, the process comprising the steps of: providing a silicon wafer having a first surface and a second surface generally opposed to each other with at least one through-via, wherein the first surface comprises an electrical interconnect; mounting the silicon wafer onto a surface of a mounting substrate such that the second surface of the silicon wafer is in contact with the surface of the mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a device for depositing balls of molten material in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills both the through-via and the cavity in the mounting substrate and the conductive material wets the interconnect to form a conductive via.

Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process.

First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder ball jet nozzle method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a solder ball jet nozzle.

Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).