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A solder ball jet nozzle is a glob of solder that connects a chip package and a PCB. You can also use solder boards to connect stacked boxes in multichip panels.

They can be mounted on circuitry boards manually or through automated equipment. Their placement is usually secured through a tacky flux.

Solder ball jet nozzles are also the most common defect that detracts from SMT assembly processes. However, solder ball jet nozzles are a double-edged sword. A solder ball jet nozzle placed within 0.13mm of traces or wider than 0.13mm in diameter violates the principle of minimum electrical clearance.

The errors that can cause a solder ball to bring about defects in an assembled PCB are innumerable. According to IPC, solder ball jet nozzles do not cause defects long as they’re held firmly in place. This article examines the good, the bad, and the ugly of solder ball jet nozzle.

The solder ball jet nozzle is a round hardened stainless ball with 8 rear jets and no front jet designed for maximum thrust for long runs. The key to the solder ball jet nozzle is the tighter rear jet angles.

It won’t get stuck on offsets in pipe as often as a standard nozzle. It will punch through a blockage, quickly releasing the blockage.

A solder ball jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder ball jet nozzle includes a body, a central duct, and an outer surface of the body.

The body includes a tip configured to deliver a solder ball jet nozzle in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball jet nozzle to the tip.

The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.

The actuation frequency of the solder ball jet nozzle is as high as 1,200 Hz but most paste formulations run at 400 to 500 dots per second or 1,440,000 dots per hour (DPH).

Shinwa designs tappets and solder ball jet nozzles for different dot sizes and application requirements. A Peltier Temperature Control Unit (TCU) maintains a constant temperature on the solder ball jet nozzle body and fluid module preventing the system from dispensing inconsistencies associated with thermal variance and heat generated from high frequency dispensing.

Because components, packaging, and solder connections keep getting smaller, it’s harder to fill the apertures with the required amount of solder ball jet nozzle. Because type 3 solder ball jet nozzle is too large for accurate and repeatable with fine pitch components, demand grows for smaller T4 and T5 solder powders.

T3 solder ball jet nozzle, will fall through a 325 mesh screen but not through a 500 mesh screen, hence the term -325+500.

Spheres categorized as Type 3, or T3, will fall through a 325 mesh screen but not through a 500 mesh screen, hence the term -325+500. This equates to particle sizes of 25 to 45µm; 80% of the particles must meet this size requirement.

Likewise, Type 4 solder ball jet nozzle will fall through a 400 mesh screen but not a 635 mesh screen, equating to particle sizes of 20 to 38µm. There is a lot of size overlap between the T3 and T4 solder powder classes; therefore, T4 solder ball jet nozzle can typically offer a slight edge in fine feature printing without presenting substantial reflow concerns.

Solder ball jet nozzle can be caused by a variety of factors, making a diagnosis of the problem somewhat challenging. In some cases, they can be completely random. Here are a few of the common reasons solder ball jet nozzle form in the PCB assembly process.

Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder ball jet nozzle to form due to escaping air or water. Ensure that printed circuit boards are dried properly before the application of solder, or make changes to control humidity in the manufacturing environment.

Solder Paste – Problems in the solder paste itself can contribute to the formation of solder ball jet nozzle. Thus, it is not advised to re-use solder paste or allow the usage of solder paste past its expiration date. Solder paste must also be properly stored and handled per the guidelines of a manufacturer. Water soluble solder paste can also contribute to excess moisture.

Stencil Design – Solder ball jet nozzle can occur when a stencil has been improperly cleaned, or when the stencil has been misprinted. Thus, trusting an experienced printed circuit board fabrication and assembly house can help you avoid these mistakes.

Reflow Temperature Profile – A flex solvent needs to evaporate at the correct rate. A high ramp-up or pre-heat rate can lead to the formation of solder ball jet nozzle. To resolve this, ensure that your ramp-up is less than 1.5°C/sec from average room temperature to 150°C.

A single-stage vacuum generator consists of a solder ball jet nozzle or a Venturi nozzle through which the compressed air is passed.

The narrowing of the solder ball jet nozzle causes the air to accelerate. As it passes through the narrow nozzle and starts to expand, a vacuum is created at the expanded side.

The air is drawn through the inlet and the compressed air exits through the silencer.