Solder ball jet nozzle sometimes appear on printed circuit boards when the dome of molten solder moves between adjacent though-hole solder joints. This is caused by a “snapping” action as the solder nozzle moves along the pins commonly seen with multi-row connectors or similar type components. Solder ball jet nozzle should be minimized as much as possible to ensure defect free results.
Solder ball jet nozzle also form inside a diffuser or riser chimney as surface tension energy is released by solder splashing from solder agitation or turbulence. These solder ball jet nozzle often adhere to colder surfaces, such as the chimney or riser, as well as to the solder mask of the PCB as the mask is softened during preheating and soldering.
Solder agitation and turbulence should be avoided as splashing solder will attach to oxygen molecules and create solder dross, due to surface energy. A grooved or sleeved riser will force controlled drainage from the nozzle and is found to greatly decrease dross creation, while dramatically reducing solder ball jet nozzle formation.