Tag: solder ball jet nozzle

We are focused on solder paste deposition for small component joining including 01005 (metric 0402) resistors and capacitors, Chip Scale Package interconnections and RF Shield soldering. Solder ball jet nozzle systems can dispense a variety of solder ball jet nozzle types. Type 4, 5, 6 and 7 formulations are Jet dispensed successfully. Dot size is dependent on solder ball jet nozzle formulation, Jet hardware component selection and process parameters.

Solder ball jet nozzle properties such as solder ball size, particle size distribution, metals to flux ratio and flux chemistry play a vital role in dot size and jetting consistency.

We work to optimize solder ball jet nozzle formulations for jetting, we use both “Jetting” and “Jet Stamping” dispensing techniques in order to meet dot size requirements and part access issues with populated assemblies.

Wide-Solder Ball Jet Nozzles

Spreads hot air over a wider area for drying, stripping paint, shaping plastic, welding bitumen, etc.

Deflector Solder Ball Jet Nozzles

Protects adjoining surfaces from overheating, such as panes of glass, corners and close quarters.

Reflector Solder Ball Jet Nozzles

Directs hot air around pipes and tubing for even heating. Used for soldering, bending and shrinking.

Silione Seam Roller

1 ¾” wide head with ball bearings.

Flexible Stand with Magnetic Base

Magnetic base keeps stand in place while working. Flexible arm allows user to adjust solder ball jet nozzles to the optimal working position.

In this application, solder ball jet nozzle dispensing for Chip Scale Packages, solder paste dots 150 microns in diameter are dispensed at high speed on to the CSP pads on the printed circuit board (PCB).

Dispensing provides better control and fewer “Insufficients” than the traditional printing process. More complex products, with a variety of solder paste deposition requirements, are pushing the limitations of printing and opening opportunities for dispensing.

Solder ball jet nozzles are as important to jetting as the power unit itself – without the correct solder ball jet nozzle – you loose efficiency and cleaning power and this will cost you time and money.

The correct solder ball jet nozzle will substantially increase the cleaning power enabling a smaller jetter unit to clean like a larger unit.

1. A process for filling a via with a conductive material, the process comprising the steps of: providing a silicon wafer with at least one through-via; mounting the silicon wafer onto a surface of a mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a solder ball jet nozzle in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills the through-via and the cavity in the mounting substrate to form a conductive via.
2. The process for filling a through-via of claim 1 wherein the silicon wafer has a thickness of at least about 28 mil.
3. The process for filling a through-via of claim 1 wherein the solder ball jet nozzle comprises a piezoelectric pressure inducer.
4. The process for filling a through-via of claim 1 further comprising the step of: reflowing the conductive material to fill the via.
5. A process for filling a through-via with a conductive material, the process comprising the steps of: providing a silicon wafer having a first surface and a second surface generally opposed to each other with at least one through-via, wherein the first surface comprises an electrical interconnect; mounting the silicon wafer onto a surface of a mounting substrate such that the second surface of the silicon wafer is in contact with the surface of the mounting substrate, the mounting substrate surface having at least one cavity, wherein the silicon wafer is positioned such that the through-via is located in line with the cavity; positioning a device for depositing balls of molten material in line with the through-via; and extruding a liquid conductive material through the solder ball jet nozzle such that the conductive material fills both the through-via and the cavity in the mounting substrate and the conductive material wets the interconnect to form a conductive via.

Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process.

First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder ball jet nozzle method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a solder ball jet nozzle.

Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).

A solder ball jet nozzle is a glob of solder that connects a chip package and a PCB. You can also use solder boards to connect stacked boxes in multichip panels.

They can be mounted on circuitry boards manually or through automated equipment. Their placement is usually secured through a tacky flux.

Solder ball jet nozzles are also the most common defect that detracts from SMT assembly processes. However, solder ball jet nozzles are a double-edged sword. A solder ball jet nozzle placed within 0.13mm of traces or wider than 0.13mm in diameter violates the principle of minimum electrical clearance.

The errors that can cause a solder ball to bring about defects in an assembled PCB are innumerable. According to IPC, solder ball jet nozzles do not cause defects long as they’re held firmly in place. This article examines the good, the bad, and the ugly of solder ball jet nozzle.

The solder ball jet nozzle is a round hardened stainless ball with 8 rear jets and no front jet designed for maximum thrust for long runs. The key to the solder ball jet nozzle is the tighter rear jet angles.

It won’t get stuck on offsets in pipe as often as a standard nozzle. It will punch through a blockage, quickly releasing the blockage.

A solder ball jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder ball jet nozzle includes a body, a central duct, and an outer surface of the body.

The body includes a tip configured to deliver a solder ball jet nozzle in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball jet nozzle to the tip.

The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.

The actuation frequency of the solder ball jet nozzle is as high as 1,200 Hz but most paste formulations run at 400 to 500 dots per second or 1,440,000 dots per hour (DPH).

Shinwa designs tappets and solder ball jet nozzles for different dot sizes and application requirements. A Peltier Temperature Control Unit (TCU) maintains a constant temperature on the solder ball jet nozzle body and fluid module preventing the system from dispensing inconsistencies associated with thermal variance and heat generated from high frequency dispensing.