{"id":144,"date":"2022-08-29T14:40:55","date_gmt":"2022-08-29T06:40:55","guid":{"rendered":"https:\/\/www.zzsinocarbide.com\/blog\/?p=144"},"modified":"2022-08-29T14:40:55","modified_gmt":"2022-08-29T06:40:55","slug":"wave-signal-applied-to-a-piezoelectric-solder-ball-jet-nozzle","status":"publish","type":"post","link":"https:\/\/www.zzsinocarbide.com\/blog\/2022\/08\/29\/wave-signal-applied-to-a-piezoelectric-solder-ball-jet-nozzle\/","title":{"rendered":"Wave signal applied to a piezoelectric solder ball jet nozzle"},"content":{"rendered":"\n<p>Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process.<\/p>\n\n\n\n<p>First, this paper presents the optimization of jet conditions of Pb\/63Sn solder droplets and the formation process of Pb\/63Sn solder bumps using a <strong><a href=\"https:\/\/zzsinocarbide.com\/news\/zzsino-produces-a-wide-range-of-micro-hole-products-11.html\">solder ball jet nozzle<\/a><\/strong> method. Second, interfacial reactions and mechanical strength of jetted Pb\/63Sn solder bumps and electroless Ni-P\/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a solder ball jet nozzle.<\/p>\n\n\n\n<p>Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb\/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb\/63Sn solder droplets and the formation process of Pb\/63Sn solder bumps using a solder ball jet nozzle method. Second, interfacial reactions [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[4],"tags":[19],"_links":{"self":[{"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/posts\/144"}],"collection":[{"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/comments?post=144"}],"version-history":[{"count":1,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/posts\/144\/revisions"}],"predecessor-version":[{"id":145,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/posts\/144\/revisions\/145"}],"wp:attachment":[{"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/media?parent=144"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/categories?post=144"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zzsinocarbide.com\/blog\/wp-json\/wp\/v2\/tags?post=144"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}